? semiconductor components industries, llc, 2012 may, 2012 ? rev. 13 1 publication order number: nl17sz125/d nl17sz125 non-inverting 3-state buffer the nl17sz125 is a high performance non ? inverting buffer operating from a 1.65 v to 5.5 v supply. features ? extremely high speed: t pd 2.6 ns (typical) at v cc = 5.0 v ? designed for 1.65 v to 5.5 v v cc operation ? overvoltage tolerant inputs and outputs ? lvttl compatible ? interface capability with 5.0 v ttl logic with v cc = 3.0 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements ? 3 ? state oe input is active ? low ? replacement for nc7sz125 ? chip complexity = 36 fets ? these devices are pb ? free and are rohs compliant ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable figure 1. pinout (top view) v cc oe in a out y gnd in a out y en oe figure 2. logic symbol 1 2 3 4 5 pin assignment 1 2 3 gnd oe in a 4 5v cc out y oe input sc ? 88a (sot ? 353) df suffix case 419a see detailed ordering and shipping information in the package dimensions sect ion on page 6 of this data sheet. ordering information function table l l h a input y output l h z l h x marking diagrams x = don?t care http://onsemi.com sot ? 553 xv5 suffix case 463b m0 m m0 = specific device code m = date code = pb ? free package m0 m m 1 5 m0 m tsop ? 5 dt suffix case 483 1 5 (*note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. udfn6 1.0 x 1.0 case 517bx m 1 y
nl17sz125 http://onsemi.com 2 maximum ratings symbol parameter value units v cc dc supply voltage ? 0.5 to +7.0 v v in dc input voltage ? 0.5 to +7.0 v v out dc output voltage ? 0.5 to +7.0 v i ik dc input diode current ? 50 ma i ok dc output diode current ? 50 ma i out dc output sink current 50 ma i cc dc supply current per supply pin 100 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias +150 c ja thermal resistance (note 1) sc ? 88a/sot ? 553 tsop ? 5 350 230 c/w p d power dissipation in still air at 85 c 150 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) 2000 200 n/a v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace with no air flow. 2. tested to eia/jesd22 ? a114 ? a. 3. tested to eia/jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. recommended operating conditions symbol parameter min max units v cc dc supply voltage 1.65 5.5 v v in dc input voltage 0 5.5 v v out dc output voltage 0 5.5 v t a operating temperature range ? 55 +125 c t r , t f input rise and fall time v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v 0 0 0 0 20 20 10 5.0 ns/v
nl17sz125 http://onsemi.com 3 device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature normalized failure rate time, years t j = 130 c t j = 120 c t j = 110 c t j = 100 c t j = 90 c t j = 80 c dc electrical characteristics symbol parameter v cc (v) t a = 25 c ? 55 c t a 125 c units condition min typ max min max v ih high ? level input voltage 1.65 to 1.95 2.3 to 5.5 0.75 v cc 0.7 v cc 0.75 v cc 0.7 v cc v v il low ? level input voltage 1.65 to 1.95 2.3 to 5.5 0.25 v cc 0.3 v cc 0.25 v cc 0.3 v cc v v oh high ? level output voltage v in = v ih 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 v i oh = ? 100 a 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 v i oh = ? 4 ma i oh = ? 8 ma i oh = ? 16 ma i oh = ? 24 ma i oh = ? 32 ma v ol low ? level output voltage v in = v il 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v i ol = 100 a 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 v i ol = 4 ma i ol = 8 ma i ol = 16 ma i ol = 24 ma i ol = 32 ma i in input leakage current 0 to 5.5 0.1 1.0 a v in = 5.5 v or gnd i oz 3 ? state output leakage 1.65 to 5.5 0.5 5.0 a v in = v ih or v il 0 v v out 5.5 v i off power off leakage current 0 1.0 10 a v in = 5.5 v or v out = 5.5 v i cc quiescent supply current 5.5 1.0 10 a v in = 5.5 v or gnd
nl17sz125 http://onsemi.com 4 ac electrical characteristics (t r = t f = 3.0 ns) symbol parameter condition v cc (v) t a = 25 c ? 55 c t a 125 c units min typ max min max t plh t phl propagation delay an to yn (figures 4 and 5, table 1) r l = 1 m c l = 15 pf 1.8 0.15 2.0 9.0 10 2.0 10.5 ns r l = 1 m c l = 15 pf 2.5 0.2 1.0 7.5 1.0 8.0 r l = 1 m c l = 15 pf r l = 500 c l = 50 pf 3.3 0.3 0.8 1.2 5.2 5.7 0.8 1.2 5.5 6.0 r l = 1 m c l = 15 pf r l = 500 c l = 50 pf 5.0 0.5 0.5 0.8 4.5 5.0 0.5 0.8 4.8 5.3 t pzh t pzl output enable time (figures 6, 7and 8, table 1) r l = 250 c l = 50 pf 1.8 0.15 2.0 7.6 9.5 2.0 10 ns 2.5 0.2 1.8 8.5 1.8 9.0 3.3 0.3 1.2 6.2 1.2 6.5 5.0 0.5 0.8 5.5 0.8 5.8 t phz t plz output disable time (figures 6, 7and 8, table 1) r l and r 1 = 500 c l = 50 pf 1.8 0.15 2.0 8.0 10 2.0 10.5 ns 2.5 0.2 1.5 8.0 1.5 8.5 3.3 0.3 0.8 5.7 0.8 6.0 5.0 0.5 0.3 4.7 0.3 5.0 capacitive characteristics symbol parameter condition typical units c in input capacitance v cc = 5.5 v, v i = 0 v or v cc 2.5 pf c out output capacitance v cc = 5.5 v, v i = 0 v or v cc 2.5 pf c pd power dissipation capacitance (note 5) 10 mhz, v cc = 3.3 v, v i = 0 v or v cc 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 9 11 pf 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl17sz125 http://onsemi.com 5 c l * figure 4. switching waveform input r l *includes all probe and jig capacitance. a 1 mhz square input wave is recommended for propagation delay tests. figure 5. t plh or t phl output oe = gnd figure 6. t pzl or t plz a 1 mhz square input wave is recommended for propagation delay tests. figure 7. t pzh or t phz a 1 mhz square input wave is recommended for propagation delay tests. c l = 50 pf r l = 500 output input r 1 = 500 2 v cc c l = 50 pf r l = 250 output v cc input 2.7 v 0 v 0 v oe on t pzh 3.0 v t phz t pzl t plz on v mo v mo v mi v cc v oh ? 0.3 v v ol + 0.3 v gnd v mi figure 8. ac output enable and disable waveform y 50% 50% v cc v cc gnd t plh t phl a table 1. output enable and disable times t r = t f = 2.5 ns, 10% to 90%; f = 1 mhz; t w = 500 ns symbol v cc 3.3 v 0.3 v 2.7 v 2.5 v 0.2 v v mi 1.5 v 1.5 v v cc/ 2 v mo 1.5 v 1.5 v v cc/ 2
nl17sz125 http://onsemi.com 6 device ordering information device package shipping ? nl17sz125dft2g sc ? 88a (sot ? 353) (pb ? free) 3000 / tape & reel NLV17SZ125DFT2G* sc ? 88a (sot ? 353) (pb ? free) 3000 / tape & reel nl17sz125xv5t2g sot ? 553 (pb ? free) 4000 / tape & reel nl17sz125dtt1g tsop ? 5 (pb ? free) 3000 / tape & reel nl17sz125cmutcg udfn6, 1.0 x 1.0 x 0.35p (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable.
nl17sz125 http://onsemi.com 7 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ? sc ? 88a (sc ? 70 ? 5/sot ? 353) case 419a ? 02 issue k 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
nl17sz125 http://onsemi.com 8 package dimensions sot ? 553, 5 lead case 463b issue b e m 0.08 (0.003) x b 5 pl a c ? x ? ? y ? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. d e y 12 3 4 5 l 1.35 0.0531 0.5 0.0197 mm inches scale 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.50 0.55 0.60 0.020 inches b 0.17 0.22 0.27 0.007 c d 1.50 1.60 1.70 0.059 e 1.10 1.20 1.30 0.043 e 0.50 bsc l 0.10 0.20 0.30 0.004 0.022 0.024 0.009 0.011 0.063 0.067 0.047 0.051 0.008 0.012 nom max 1.50 1.60 1.70 0.059 0.063 0.067 h e 0.08 0.13 0.18 0.003 0.005 0.007 0.020 bsc
nl17sz125 http://onsemi.com 9 package dimensions tsop ? 5 case 483 ? 02 issue h notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 l 1.25 1.55 m 0 10 s 2.50 3.00 123 54 s a g l b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 t seating plane 0.05 k m detail z detail z
nl17sz125 http://onsemi.com 10 package dimensions case 517bx issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.20 mm from terminal tip. 4. package dimensions exclusive of burrs and mold flash. 6x 6x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dimension: millimeters recommended l1 detail a l alternate terminal construction ?? ?? 0.52 1.20 0.25 0.35 pitch package outline 1 dim min max millimeters a 0.50 0.65 a1 0.00 0.05 a3 0.13 ref b 0.17 0.23 d 1.00 bsc e 1.00 bsc e 0.35 l 0.20 0.40 l1 ??? 0.15 l3 l3 0.26 0.33 a b e d bottom view b e 6x l 6x note 3 0.08 c pin one reference top view 0.08 c a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 2x 2x a3 detail b a m 0.07 b c m 0.05 c detail a on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. nl17sz125/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
|
